Tresky Automation is further expanding its expertise in contract manufacturing and has invested in new, modern production machines. Customers now benefit from a highly developed vacuum brazing furnace and a powerful sintering press that offers a maximum pressing force of up to 15 kN.
With these new systems, Tresky Automation is expanding its portfolio of production technologies that are specially optimised for demanding applications in areas such as photonics, optoelectronics, hybrid bonding, microelectronics and power electronics.
The new vacuum brazing furnace enables the production of material bonds under controlled conditions, for example with nitrogen (N2) or formic acid (HCOOH). This process significantly reduces air inclusions, as the vacuum effectively removes air and process residues during the preheating and melting phase of the solder. The result is virtually non-porous and flux-free solder joints that are highly reliable.
Technology for innovative manufacturing processes
In addition to vacuum brazing technology, the new sintering press expands Tresky's range in the field of assembly and joining technology. Metallic sintering creates solid bonds between materials such as silver (Ag) or copper (Cu) under pressure and temperature. This process is ideal for heavy-duty and thermally sensitive applications and offers decisive advantages, particularly in power electronics and applications with high thermal and mechanical requirements.
With a maximum contact force of up to 15 kN, the sintering press opens up new possibilities for innovative manufacturing processes and strengthens Tresky's position as a supplier of advanced joining technologies.
‘With these new systems, we are expanding our wide range of manufacturing processes. These investments also emphasise our commitment to always being at the forefront of technological developments and offering our customers the best possible solutions for their individual requirements,’ explains Daniel Schultze, Managing Director of Tresky GmbH in Henningsdorf near Berlin.
